New Delhi: MediaTek introduced the Dimensity 6100+ System-on-Chip (SoC), a groundbreaking mid-range chip poised to bring premium features to a wider audience at an affordable price. Developed on the TSMC N4 process node, the Dimensity 6100+ showcases two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores. It also integrates the Mali-G77 MC9 GPU, a 5G modem supporting up to 140MHz 2CC 5G Carrier Aggregation, and the cutting-edge MediaTek Ultra Save 3.0+ power-saving technology.
Designed to fuel an extensive range of mainstream 5G smartphones, including gaming, photography, and entertainment devices, the Dimensity 6100+ delivers smooth performance for demanding applications and games. Moreover, it boasts AI-powered camera capabilities and support for high-quality displays.
Dr. Yenchi Lee, Corporate VP of MediaTek, expressed confidence in the Dimensity 6100+, stating, "The Dimensity 6100+ is a powerful and versatile chip that is ideal for mainstream 5G smartphones. The chip offers a great balance of performance, features, and power efficiency, and we are confident that it will be a popular choice for smartphone manufacturers."
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Anticipated to hit the market in Q3 of 2023, the Dimensity 6100+ is primed to empower the next generation of smartphones with its exceptional features and capabilities.
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Features of the Dimensity 6100+ SoC:
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The Dimensity 6100+ represents a significant advancement over its predecessor, the Dimensity 6100, incorporating various enhancements and new features. With its enhanced power, efficiency, and expanded capabilities, this chip is an excellent choice for mainstream 5G smartphones, poised to gain popularity among smartphone manufacturers worldwide.
